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Ultrasonic transducer and method of manufacturing the same
专利权人:
SAMSUNG ELECTRONICS CO.; LTD.
发明人:
Seok-whan Chung
申请号:
US14023821
公开号:
US09603581B2
申请日:
2013.09.11
申请国别(地区):
US
年份:
2017
代理人:
摘要:
An ultrasonic transducer includes: a first electrode layer disposed on an upper substrate and a support; a second electrode layer which is disposed on a lower surface of the upper substrate and is separated from the first electrode layer; an upper electrode disposed on an upper surface of a membrane to contact an upper surface of the first electrode layer; a trench formed through the upper electrode, the membrane, the support, and the upper substrate; and a pad substrate disposed under the upper substrate and including bonding pads that electrically connect to the first and second electrode layers, respectively.
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