Disclosed are hair or skin conditioning compositions comprising by weight: (a) from about 0.1% to about 10% of a thickening polymer system (b) from about 0.1% to about 8.0% of a surfactant system selected from the group consisting of cationic surfactant, nonionic surfactant, and mixtures thereof (c) from about 0.1% to about 10% of a hydrophobically modified amido silicone copolyol and (d) an aqueous carrier wherein the composition has a transmittance of 25% or more and/or wherein the composition has a viscosity of from about 1,000 cps to about 50,000 cps and Shear Thinning Index of 30 or more. The compositions are especially suitable for hair care products such as hair conditioning products for rinse-off/leave-on use.