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Improved heat sink and heat dissipation structure
专利权人:
TTI (Macao Commercial Offshore) Limited
发明人:
Lee, Hei Man Raymond
申请号:
AU2016102435
公开号:
AU2016102435A4
申请日:
2016.09.21
申请国别(地区):
AU
年份:
2020
代理人:
摘要:
#$%^&*AU2016102435A420200213.pdf#####A printed circuit board assembly (PCBA) has a heat source, a heat sink, and an exit vent. The heat source generates heat, typically excessive heat and the heat sink conducts heat from the heat source and heats up the surrounding air to form heated air. The heated air then passes through the exit vent which is positioned adjacent to the heat sink. In addition, a heat dissipation structure contains a fan to move air, a heat source distal from the fan, an exit vent proximal to the fan, and an airflow path running from the heat source to the fan to the exit vent. The heat source heats the air to form heated air. When the fan is activated, the fan draws air through the airflow path from the heat source and out of the exit vent.WO 2018/053729 PCT/CN2016/099638 26 36 36 22 / 38-- Fig.I1 28 10 24 26 20 3 Fig. 2 1/2
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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