#$%^&*AU2016102435A420200213.pdf#####A printed circuit board assembly (PCBA) has a heat source, a heat sink, and an exit vent. The heat source generates heat, typically excessive heat and the heat sink conducts heat from the heat source and heats up the surrounding air to form heated air. The heated air then passes through the exit vent which is positioned adjacent to the heat sink. In addition, a heat dissipation structure contains a fan to move air, a heat source distal from the fan, an exit vent proximal to the fan, and an airflow path running from the heat source to the fan to the exit vent. The heat source heats the air to form heated air. When the fan is activated, the fan draws air through the airflow path from the heat source and out of the exit vent.WO 2018/053729 PCT/CN2016/099638 26 36 36 22 / 38-- Fig.I1 28 10 24 26 20 3 Fig. 2 1/2