Backing substrates for reducing parasitic echoes produced within a ultrasonic transducer are provided comprising a polymeric material, for example, an epoxy having a glass transition temperature (Tg) ranging from about 10 to 50° C. or an epoxy having an acoustical attenuation that increases by at least about 2 dB/mm at 5 MHz in a temperature range of about 5° C. to 40° C. Transducer assemblies comprising the backing substrates and methods for producing the assemblies are also provided.
