The present invention relates to the field of medical devices, and specifically to a packaging structure for a retinal prosthesis implant chip and a packaging method therefor. The packaging structure comprises a high-density stimulation electrode component manufactured by means of glass substrate processing. The stimulation electrode component comprises a glass substrate and a plurality of stimulation electrodes and a pad structure provided on the glass substrate. The stimulation electrodes are manufactured by means of cutting to form metal pins on a metal piece and glass pouring. The stimulation electrode component is connected to an ASIC chip covered by a glass packaging cover. A metal feedthrough structure for communicating with the stimulation chip is provided at the glass packaging cover. The packaging cover also covers the pad structure. The packaging structure, the substrate and the packaging cover of the present invention are all made of glass and thereby enable manufacture of a high-density stimulation electrode array. The glass cover is directly provided with the metal feedthrough structure, improving the ease of wiring, and sealing performance.
