An implantable device for the reversible accommodation of an electrode lead portion of at least one electrode lead, including a first outer surface and a second outer surface which extends parallel to the first outer surface at a distance therefrom, the first outer surface having at least one guide which can be used to guide and accommodate the portion of the electrode lead. According to a second aspect, the electromedical implant includes the above-described device and an electronic circuit with a power supply, a multipiece housing which hermetically seals the circuit and the power supply, and a connector housing which is fastened to the multipiece, hermetically sealed housing and has connectors for at least one electrode lead, the connectors being electrically connected to the electronic circuit. The electromedical implant is characterized in that the second outer surface of the device is integrated into and forms a part of the housing.
