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METHOD OF FABRICATING HIGH DENSITY HERMETIC ELECTRICAL FEEDTHROUGHS USING INSULATED WIRE BUNDLES
专利权人:
Kedar G. Shah
发明人:
Kedar G. Shah,William J. Bennett,Satinderpall S. Pannu
申请号:
US15147774
公开号:
US20160254080A1
申请日:
2016.05.05
申请国别(地区):
US
年份:
2016
代理人:
摘要:
A method of fabricating electrical feedthroughs coats of a plurality of electrically conductive wires with an electrically insulating material and bundles the coated wires together in a substantially parallel arrangement. The bundled coated wires are secured to each other by joining the electrically insulating material of adjacent wires together to form a monolithic block which is then cut transverse to the wires to produce a block section having opposing first and second sides with a plurality of electrically conductive feedthroughs extending between them.
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