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MANUFACTURING METHOD FOR A MICROLEAD
专利权人:
Heraeus Deutschland GmbH &; Co. KG;Heraeus Medical Components LLC
发明人:
Oliver Keitel,Markus Jung,Mark A. Hjelle,Larry Lark
申请号:
US16358115
公开号:
US20190290898A1
申请日:
2019.03.19
申请国别(地区):
US
年份:
2019
代理人:
摘要:
One aspect is a manufacturing method including providing at least a first electrically conductive wire with an electrical insulation and a second electrically conductive wire with an electrical insulation, providing a first and a second ring electrode surrounding the wires, electrically connecting the first ring electrode with the first wire and the second ring electrode with the second wire, bundling the ring electrodes and the wires by means of a first sheath surrounding the ring electrodes and the wires to obtain a first ring electrode component, providing a second ring electrode component, bundling the ring electrode components by means of a second sheath surrounding the ring electrode components, and partially removing the first and the second sheaths from the ring electrodes to expose ring electrode portions.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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