A manufacturing method of an image pickup apparatus 1 includes a step of manufacturing an image pickup device chip 20, a step of manufacturing a wiring board 30 having first terminals 31 and second terminals 32 disposed on both sides of a first primary surface 30SA with a central flexible portion 30F intervened in between, a step of joining a heat conductive block 40 to a second primary surface 30SB of the wiring board 30, a step of joining the image pickup device chip 20 to the first terminals 31 of the wiring board 30, a step of performing solder joining of core wires 51 of a cable 50 to the second terminals 32 of the wiring board 30 by conducting heat generated by a heat tool 80 through the heat conductive block 40, a step of bending the wiring board 30, and a step of performing housing inside a frame member 70, and sealing with sealing resin 71.
