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積層実装構造体
专利权人:
オリンパス株式会社
发明人:
関戸 孝典
申请号:
JP2009259165
公开号:
JP5424825B2
申请日:
2009.11.12
申请国别(地区):
JP
年份:
2014
代理人:
摘要:
A laminate mount assembly includes a first member that includes an inter-member connection electrode that is provided on an end surface that forms a predetermined inter-member connection side surface a second member that includes an inter-member connection electrode that is provided on an end surface that forms the inter-member connection side surface, the second member being arranged to be parallel with the first member and a conductive film that electrically connects the inter-member connection electrodes to each other over a portion in which the first member and the second member are opposite to each other.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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