PROBLEM TO BE SOLVED: To effectively cool an endoscope tip limited in space.SOLUTION: In an endoscope tip, an imaging module 20 comprising an image pickup device 21 and a substrate 22 is disposed, and a cylindrical Peltier element 30 is disposed at a substrate rear part on the opposite side to the tip. A casing part 22B is provided to cover a wire CL extending from a substrate body 22A, and is fitted into a hollow part of the Peltier element 30 for intimate contact.