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ADHESIVE PLASTER MODULE
专利权人:
NIHON KOHDEN CORPORATION;SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人:
Kazuyuki KUBOTA,Kaori YOKOTA,Norihito KONNO
申请号:
US15338534
公开号:
US20170150927A1
申请日:
2016.10.31
申请国别(地区):
US
年份:
2017
代理人:
摘要:
An adhesive plaster module which has an adhesive layer for adhering to an object includes a substrate having the adhesive layer, a switch mounted on a same side of the substrate as the adhesive layer, a battery mounted on an opposite side of the substrate from the adhesive layer, and an electronic component mounted on the opposite side of the substrate from the adhesive layer, and configured to operate with power supplied from the battery upon the switch becoming conductive, wherein the switch is configured to be nonconductive while the adhesive layer is not attached to the object, and configured to become conductive in response to attaching the adhesive layer to the object.
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