A pattern transferring apparatus is disclosed which can prevent damage to a transferred pattern and realize fast mold release regardless of the type of resist. The pattern transferring apparatus transfers a pattern formed on a mold to an object by bringing the mold into contact with the apparatus has a deformer which causes deformation in the mold for releasing the mold from the object. The apparatus transfers a pattern formed on a mold to a photo-curing resin by bringing the mold into contact with the photo-curing resin and applying light thereto to cure the photo-curing resin. The apparatus has an optical system which applies light at an irradiation light intensity to a non-transfer area other than a transfer area where the pattern is to be transferred in the photo-curing resin, the intensity being different from an irradiation light intensity of light applied to the transfer area.
