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Ultrasonic sensor and manufacturing method thereof
专利权人:
セイコーエプソン株式会社
发明人:
大橋 幸司,小島 力,岩井 光
申请号:
JP2015061755
公开号:
JP6587051B2
申请日:
2015.03.24
申请国别(地区):
JP
年份:
2019
代理人:
摘要:
An ultrasonic sensor includes: a substrate disposed across an XY plane; a plurality of spaces formed in the substrate in at least one direction of an X-axis direction and a Y-axis direction; a vibrating plate that is provided on the substrate such that the spaces are enclosed and that has a first surface on the substrate side and a second surface facing the first surface; a piezoelectric element that is provided at a portion on the second surface side of the vibrating plate that corresponds to the space and that transmits and/or receives an ultrasonic wave; a surrounding plate that is provided on the second surface side of the vibrating plate and surrounds a peripheral region of the piezoelectric element; and a support member provided at a position, at which the support member is not overlapped with the piezoelectric element, between a surface of the surrounding plate on the piezoelectric element side and the second surface of the vibrating plate.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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