A radiation imaging apparatus (100, 300, 400, 500, 600, 700) includes a sensor base (101), a sensor array that includes a plurality of sensor chips (103) arranged in an array, and in which three or more sensor chips out of the plurality of sensor chips are arranged in one row of the sensor array, a scintillator (105) positioned on a side opposite to the sensor base with respect to the sensor array, a bonding member (104) that bonds the sensor array and the scintillator, and a plurality of bonding sheets (102) that are separated from each other and bond the sensor base and the plurality of sensor chips. Two adjacent sensor chips out of the three or more sensor chips are bonded to the sensor base using separate bonding sheets out of the plurality of bonding sheets.
