It includes the adhesive compound which builds a bridge or more the copolymer of 1 types or 2 types in the adhesion agent layer, the case where that adhesion agent layer is produced it designates that the percutaneous absorption die formulation which can compact curing period is offered as topic. The percutaneous absorption die formulation of this invention, is located on the base material and this base material, the adhesive compound and the adhesion agent layer which contains the medicine component and, it is the percutaneous absorption die formulation which it has, it includes the resin blend where the aforementioned adhesive compound consists of the acrylic copolymer (A)100 mass section of specification, and the acrylic copolymer (B)0.1 - 30 mass sections or the polyamine compound 0.05 - 2 mass sections of specification, furthermore it features that the organicity Acid is included in the aforementioned adhesion agent layer.1種類又は2種類以上の共重合体を架橋させた粘着剤を粘着剤層に含み、その粘着剤層を作製する際の養生期間を短縮することのできる経皮吸収型製剤を提供することを課題とする。本発明の経皮吸収型製剤は、支持体と、この支持体上に位置し、粘着剤及び薬剤成分を含有する粘着剤層と、を備える経皮吸収型製剤であって、前記粘着剤が特定のアクリル系共重合体(A)100質量部、及び特定のアクリル系共重合体(B)0.1~30質量部若しくはポリアミン化合物0.05~2質量部からなる樹脂混合物を含み、前記粘着剤層にはさらに有機酸が含まれることを特徴とする。