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研削装置および研削方法
专利权人:
パナソニック株式会社
发明人:
瀬川 彰継,濱野 誠司,菅田 文雄
申请号:
JP2010517669
公开号:
JP5094974B2
申请日:
2009.04.06
申请国别(地区):
JP
年份:
2012
代理人:
摘要:
A grinding apparatus (100) includes: a rotating grinding tool (102) for grinding a workpiece (101) immersed in a cooling liquid (106) vibration generating mechanisms (107a) to (107f) for applying vibrations to the cooling liquid (106) and generating cavitation and a controller (108) for causing the vibration generating mechanisms (107a) to (107f) to generate the cavitation when the rotating grinding tool (102) is operated. The controller (108) turns on/off the vibration generating mechanisms (107a) to (107f) and adjusts amplitudes of the vibrations of the cooling liquid (106) generated by the vibration generating mechanisms (107a) to (107f) depending on a region in the workpiece (101) to be machined and one out of a plurality of machining steps to be performed.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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