Jacobsen, Brad,Burg, Bruce M.,Jain, Abhishek,Bzostek, Andrew
申请号：
AU2014209323
公开号：
AU2014209323A1
申请日:
2014.01.23
申请国别(地区):
AU
年份:
2015
代理人:
摘要：
A flexible circuit assembly can include a base layer (244), a plurality of circuit traces (350) and an insulative layer (362). The plurality of circuit traces can each be coupled to a pair of circuit pads, and the circuit traces can be formed on an upper side of the base layer. The insulative layer can be formed over the circuit traces to isolate the circuit traces from an external environment. The base layer, plurality of circuit traces and insulative layer can form a flexible circuit sheet (232). The base layer and the insulative layer can include material properties and a thickness configured to facilitate the flexible circuit sheet being flexible such that the flexible circuit sheet is adapted to conform to a non-planar surface of the medical device (100).
