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RESIN LAMINATED FILM FOR FORMING BLISTER PACK AND BLISTER PACK
专利权人:
SHIONOGI & CO.; LTD.
发明人:
TAMURA, TAKUMI,HIRAMOTO, SHINJI,HAMAMOTO, KEIJI,TSUJI, TAKUYA
申请号:
EP08777218
公开号:
EP2163379A4
申请日:
2008.06.13
申请国别(地区):
EP
年份:
2012
代理人:
摘要:
Blister packaging multilayer resin films and blister packages of the invention achieve a lower oxygen permeability than possible heretofore.A blister packaging multilayer resin film of the invention is used to produce a blister package in which an item is sealed between a support substrate and the multilayer resin film, wherein the multilayer resin film includes an oxygen barrier layer that is arranged on a side of the multilayer resin film which side faces the support substrate, and a moisture proof layer that is arranged on a side of the oxygen barrier layer which side does not face the support substrate.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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