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IMPLANTABLE LEAD WITH BODY PROFILE OPTIMIZED FOR IMPLANT ENVIRONMENT
专利权人:
INC.;PACESETTER
发明人:
Dorab N. Sethna,Steven R. Conger
申请号:
US13691028
公开号:
US20140155966A1
申请日:
2012.11.30
申请国别(地区):
US
年份:
2014
代理人:
摘要:
Implementations described and claimed herein provide an implantable lead optimized for an implant environment and methods of manufacturing such implantable leads. The implantable lead includes an insulation layer having one or more transitions along a length of the insulation layer from a proximal end to a distal end. Each of the transitions is a seamless change from a section of the insulation layer having a set of performance characteristics to another section of the insulation layer having a different set of performance characteristics.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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