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IMPLANT HAVING POROUS LAYER AND MOLDING METHOD THEREOF
专利权人:
Corentec Co.; LTD
发明人:
Goon-Hee Lee,Oui-Sik Yoo,Young-Woong Jang
申请号:
US15605465
公开号:
US20170348107A1
申请日:
2017.05.25
申请国别(地区):
US
年份:
2017
代理人:
摘要:
An implant having a porous layer and a molding method thereof includes: a substrate having a bone contact surface being in part in direct contact with a bone of a patient; a porous layer having a void inside; a connecting layer disposed between the bone contact surface and the porous layer to attach the bone contact surface to the porous layer; and a rib detachably coupled to the porous layer, wherein the connecting layer includes at least one constituent component identical to one of constituent components in the bone contact surface to be integrated into the porous layer and the bone contact surface, thereby firmly attaching the porous layer to the bone contact surface. Accordingly, bonding of dissimilar metals is facilitated by inducing the attachment of the bone contact surface of the implant to the porous layer having a void inside, formed by dissimilar metals, through the connecting layer including at least one constituent component identical to one of constituent components of the bone contact surface.
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中国工程科技知识中心
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