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Method of contact coating a microneedle array
专利权人:
发明人:
申请号:
EP11178166.2
公开号:
EP2388078B1
申请日:
2005.11.18
申请国别(地区):
EP
年份:
2013
代理人:
摘要:
A method of coating a microneedle array by applying a coating fluid using a flexible film (200) in a brush-like manner. A method of coating a microneedle array comprising: providing a microneedle array having a substrate (220,420) and a plurality of microneedles providing a flexible film (200,400,800) providing a coating solution comprising a carrier fluid and a coating material applying the coating solution onto a first major surface of the flexible film performing a transfer step of bringing the first major surface of the flexible film into contact with the microneedles and removing the flexible film from contact with the microneedles and allowing the carrier fluid to evaporate.
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