ДЭВИДСЕН Ричард Эдвард (NL),ФРИМАН Стивен Расселл (NL),СЕЙВОРД Бернард Джозеф (NL)
申请号：
RU2013155904/14
公开号：
RU2013155904A
申请日:
2012.05.11
申请国别(地区):
RU
年份:
2015
代理人:
摘要：
1. A probe with an ultrasonic matrix transducer, comprising: a transducer package having a transducer element matrix connected to a specialized integrated circuit (ASIC) for the transducer matrix； a heat-conducting casing that is thermally connected to the transducer package； a housing forming a probe handle and covering at least part of the frame； heat-conducting radiator, which is thermally connected to the frame and contains an external surface that abuts and thermally connects to the inner surface of the case and to the main path of heat conduction from the radiator to the thermally connected case and then to the air surrounding the case, in order to prevent the formation of hot in the case points. 2. A probe according to claim 1, wherein the matrix of the converter elements further comprises a two-dimensional matrix of converter elements. The probe of claim 2, wherein the ASIC further comprises a beamforming ASIC that at least partially generates transmitted beams from the array and an echo received by the elements of the array. A probe according to claim 1, wherein the package of converters further comprises a heat-conducting lining located between the ASIC and the frame. A probe according to claim 1, further comprising a thermal pad or thermal grease that provides a thermal connection between the frame and the radiator. 6. A probe according to claim 5, in which the frame has side sides and in which the radiator is in heat-conducting contact with the side sides of the frame. A probe according to claim 6, in which the radiator is screwed or bolted to the side edges of the frame. A probe according to claim 1, further comprising a thermal pad or a thermo1. Зонд с ультразвуковым матричным преобразователем, содержащий:пакет преобразователей, имеющий матрицу элементов преобразователя, соединенную со специализированной интегральной микросхемой (ASIC) для матрицы преобразователя；теплопроводный каркас, который термически соединен с пакетом преобразователей；корпус, обра
