The present invention relates to a patch package structure which includes: a package including a first sheet material and a second sheet material, the first and second sheet materials being sealed together in peripheral parts thereof and a patch disposed in the package, the patch contains a backing, a pressure-sensitive adhesive layer laminated on at least one side of the backing, and a release liner which protects a pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer, the release liner having on a surface thereof a cut line supporting a peel-off of the release liner at the time of using the patch, the patch being disposed in the package so that the release liner faces the inner surface of the first sheet material, the first sheet material having a first region in which the inner surface of the first sheet material faces the cut line of the release liner, the first sheet material having in the first region a minimum first distance between the inner surface of the first sheet material and the surface of the release liner, and the inner surface of the first sheet material being spaced from the surface of the release liner at the minimum first distance in the first region.
