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WOUND HEALING
专利权人:
Inc.;Cytosolv
发明人:
Christopher Thanos,Briannan Bintz
申请号:
US14850755
公开号:
US20180008644A1
申请日:
2015.09.10
申请国别(地区):
US
年份:
2018
代理人:
摘要:
The invention relates to methods and compositions for improving wound healing and in particular for preventing scar formation and thus loss of function that can occur in injured tissues during the natural wound healing process. Particularly, although by no means exclusively, the invention relates to the healing of chronic wounds such as diabetic ulcers.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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