A feedthrough subassembly attachable to an active implantable medical device includes an electrically conductive grounding path between a first end located on the device side and configured to electrically connect with a plurality of ground electrode plates of a device side capacitor and a second end electrically connected to a ferrule. The grounding path may be one of the following options: a grounded via hole and a plurality of insulator ground plates disposed within the insulator body a grounding fill at least partially disposed within the grounding via hole including an exposed side portion a peninsula structure formed as part of the conductive ferrule body extending into the ferrule opening a grounding composite fill disposed within a grounding recess including an exposed side a perimeter braze extending into a grounding recess forming a braze channel and a metallic clip disposed within a grounding recess and electrically contacting a braze channel.
