Rothberg, Jonathan M.,Alie, Susan A.,Zahorian, Jaime Scott,Cristman, Paul Francis,Fife, Keith G.
申请号：
AU2017281280
公开号：
AU2017281280A1
申请日:
2017.06.19
申请国别(地区):
AU
年份:
2018
代理人:
摘要：
An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.
