Radially divided adhesive wafers are provided for applying to the skins of a human, and which increase the wear time for such adhesive wafers. The adhesive wafer includes a through-going hole for communication with a body opening and an adhesive proximal side for attachment of the wafer to the skin. The adhesive wafer has an inner annular adhesive layer, an outer annular adhesive layer encircling the inner annular adhesive layer, an attachment zone on the distal side of the wafer for attaching a collection bag, and a connecting element for mechanically connecting the first annular adhesive layer to the second annular adhesive layer. The connecting element includes first and second connection areas on the distal side of the respective first and second annular adhesive layers, at least one connection area being radially spaced from the radial edges of the respective annular adhesive layer.
