The present disclosure illustrates a light emitting diode packaging structure and a camera module having the same. The light emitting diode packaging structure comprises a transparent package member, a plurality of light emitting diodes, and a plurality of conductive wires. The transparent package member has a geometrical shape with an opening located at the center thereof. The opening tightly fits with lens module. The plurality of light emitting diodes are located in the transparent package member. The plurality of light emitting diodes are electrically connected with the plurality of conductive wires, and parts of the plurality of conducting wires are exposed to outside of the transparent package for receiving electric power to provide driving power to the plurality of light emitting diodes. The camera module comprises an image sensor, a lens module, and the light emitting diode packaging structure.
