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Laser Assisted Wound Healing Protocol and System
专利权人:
LLC;BioRegentech
发明人:
Margaret Kalmeta
申请号:
US16349222
公开号:
US20200188686A1
申请日:
2017.11.13
申请国别(地区):
US
年份:
2020
代理人:
摘要:
The present invention provides for devices and methods of treating wounds, including general wounds, gum disease and gingival tissues post scaling/root planning, using a diode laser which generates a beam of light having a wavelength in the visible portion of the electromagnetic spectrum (400 nm-700 nm). Further disclosed are devices and methods capable of stimulating tissue regeneration at the site of a wound.
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中国工程科技知识中心
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