By this invention, the inorganic primary particle mean particle diameter 10 - 1000nm cohering, as the surface of the inorganic cohesion particle and each inorganic primary particle which become is covered, while being the organic resin phase which connects each inorganic primary particle mutually and the organic resin phase which covers the surface of each inorganic primary particle it is formed, the pore volume which was measured with method of mercury penetration (here, pore pore diameter it is the hole of the range 1 - 500nm) the cohesion gap 0.01 - 0.30cm3/g and, the organic inorganic compound filler, and its production method of including it is disclosed.本発明により、平均粒子径10~1000nmの無機一次粒子が凝集されてなる無機凝集粒子と、各無機一次粒子の表面を覆うと共に、各無機一次粒子を相互に結合する有機樹脂相と、各無機一次粒子の表面を覆う有機樹脂相の間に形成され、水銀圧入法で測定した細孔容積(ここで、細孔とは細孔径が1~500nmの範囲の孔をいう)が0.01~0.30cm3/gの凝集間隙と、を含む有機無機複合フィラー、及びその製造方法が開示される。