Provided are an imaging unit and an endoscope that can reduce the size of an imaging unit by improving the mounting density of electronic components and the like, and can align a prism on an imaging element without using a special jig or the like. . The imaging unit 10 according to the present invention includes a prism 40 for condensing light, an imaging element 21, a semiconductor package 20 having a sensor electrode formed on the back side, a plurality of electronic components 51, and a first on the front side. A connection electrode 31 is formed, a second connection electrode for connecting the electronic component 51 on the back side, and an inspection electrode 35 are formed, and the periphery of the electronic component mounting region R1 where the second connection electrode is formed. Walls 33 higher than the height of the plurality of electronic components 51 are formed on at least two opposing sides, and the maximum thickness of the inspection electrode placement region R2 where the inspection electrodes 35 are formed is equal to that of the electronic component mounting region R1. It is characterized by being thinner than the thickness including the wall portion 33.電子部品等の実装密度を向上して撮像ユニットの小型化を可能とするとともに、特殊な治具等を使用することなくプリズムを撮像素子上に位置合わせ可能な撮像ユニットおよび内視鏡を提供する。本発明における撮像ユニット１０は、光を集光するプリズム４０と、撮像素子２１を有し、裏面側にセンサ電極が形成された半導体パッケージ２０と、複数の電子部品５１と、表面側に第１接続電極３１が形成され、裏面側に電子部品５１を接続する第２接続電極と、検査用電極３５とが形成されており、前記第２接続電極が形成された電子部品実装領域Ｒ１の周囲の少なくとも対向する２辺には、複数の電子部品５１の高さより高い壁部３３が形成され、検査用電極３５が形成される検査用電極配置領域Ｒ２の最大厚さは、電子部品実装領域Ｒ１の壁部３３を含む厚さより薄いことを特徴とする。
