Andre Mercanzini,Zbynek Struzka,Jason Jinyu Ruan,Pascal Harbi,Alain Jordan
申请号：
US15910278
公开号：
US20190269906A1
申请日:
2018.03.02
申请国别(地区):
US
年份:
2019
代理人:
摘要：
The present disclosure describes an implantable lead device that includes an internal support comb. The support comb can include one or more faces that enable the alignment, routing, and holding of the lead device's internal wires. The support comb can enable the interconnection of the wires with to the microelectrode film that includes the lead device's electrodes.
