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Multi-layered structure and method
专利权人:
发明人:
Jami A. Hafiz,Stefan Schibli,Jens Troetzschel
申请号:
US14323163
公开号:
US09498142B2
申请日:
2014.07.03
申请国别(地区):
US
年份:
2016
代理人:
摘要:
One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.
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