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LIQUID-HEATED MOLD AND METHOD OF USING SME
专利权人:
KONINKLIJKE PHILIPS N.V.
发明人:
RICHARD THOMAS HAIBACH,Anthony Vincent Startare,Gregory John Jablonski
申请号:
US16615837
公开号:
US20200215726A1
申请日:
2018.05.15
申请国别(地区):
US
年份:
2020
代理人:
摘要:
The present system is configured to absorb, using a fluid medium in a reservoir, electromagnetic radiation to heat the fluid medium. The fluid medium may then conduct heat into a mold cavity formed by interior mold surfaces of at least two mold pieces. The fluid medium may heat up to, but not beyond, a phase transition temperature of the fluid medium, reducing instances of accidental damage to moldable material in a mold cavity during thermally-accelerated curing of the moldable material. In some instances a mold may be placed in liquid contained by the reservoir. In some instances, a mold may have integral reservoirs in individual mold pieces.
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