A stimulation system includes an implantable pulse generator having a sealed chamber and an electronic subassembly disposed in the sealed chamber. Feed through pins are coupled to the electronic subassembly and extend out of the sealed chamber. Feed through interconnects are coupled to the electronic subassembly via the feed through pins. At least one tab is disposed on at least one feed through interconnect. The tab(s) are configured and arranged to flex away from the feed through interconnect and against a side of the feed through pin.A feed through interconnect assembly includes an assembly frame feed through interconnects extending from the assembly frame a first contact pad and a second contact pad disposed on at least one of the feed through interconnects and a tab formed on a first contact pad of at least one of the feed through interconnects.
