SCHIMPF, SAMUEL,MCCHRYSTAL, MARK,STARK, JOSEPH C., III,SIEBENHAAR, ANDRE
申请号：
EP13832936
公开号：
EP2890417A4
申请日:
2013.08.30
申请国别(地区):
EP
年份:
2016
代理人:
摘要：
A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
