John L. Parker,David Robinson,David Thomas,Mark Fretz
申请号：
US13512115
公开号：
US09072910B2
申请日:
2010.11.26
申请国别(地区):
US
年份:
2015
代理人:
摘要：
Methods of forming feedthroughs for hermetically sealed housings using powder injection molding, including positioning a plurality of separate electrically conductive elements in a mold, injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form a plurality of insulative bodies around the conductive elements, sintering the insulative bodies to form the plurality of feedthroughs physically connected to one another via the conductive elements and severing the conductive elements between neighboring insulative bodies.
