INDUSTRY-ACADEMIC COOPERATION FOUNDATION; YONSEI UNIVERSITY
发明人:
Kang-Yell Choi,Soung-Hoon Lee,Hyun-Yi Kim
申请号：
US14567268
公开号：
US09763994B2
申请日:
2014.12.11
申请国别(地区):
US
年份:
2017
代理人:
摘要：
The present disclosure relates to a composition for promoting wound healing that may be used as a pharmaceutical composition, or a cosmetic composition for promoting wound healing, which contains a polypeptide including an amino acid sequence of SEQ ID NO 1. The composition may be usefully used for a wound care drug or a functional cosmetic product for wound care.
