PROBLEM TO BE SOLVED: To provide a method for evaluating fusibility of a granular resin composition which excels in fusibility and fluidity, while preventing resin leakage, in manufacturing a semiconductor device formed by compression molding, and a method for manufacturing the semiconductor device.SOLUTION: A method for evaluating fusibility of a granular resin composition includes: fusing a granular resin composition by heating at a melting temperature or higher until the granular resin composition is hardened while maintaining its fused appearance; acquiring luminance information from a surface state of the granular resin composition fused by heating; and evaluating the fusibility of the granular resin composition on the basis of the luminance information. A method for manufacturing a resin-sealed semiconductor device includes: selecting, using the fusibility evaluation method, a granular resin composition having a skewness of 0 to less than 2.5 and kurtosis of 0 to less than 5 in a histogram; and using th
