Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates
Robert Brindley,John Janik,Edward Chia-Ning Tang,James Bernard Dunlop,Joseph Leland Spangler
申请号：
US15713291
公开号：
US09950154B2
申请日:
2017.09.22
申请国别(地区):
US
年份:
2018
代理人:
摘要：
A method of forming an implantable electrode array that includes one or more packaged control modules. A control module is packaged by mounting the module to a substrate and forming a containment ring around the module. A conformal coating is disposed over the surface of the module to cover the carrier. Within the containment ring, the conformal coating hardens to form a non-porous shell around the control module. The one or more packaged control modules are placed in a flexible array. Electrodes that are mounted to or embedded in the flexible carrier are connected to the one or more control modules.
