Farhad Bahremand,Brad A. Pulver,Bahman Guyuron,Jamie Horvath
申请号：
US14802506
公开号：
US20160015560A1
申请日:
2015.07.17
申请国别(地区):
US
年份:
2016
代理人:
摘要：
The present disclosure provides methods to improve the performance of heat exchangers used in thermoelectric cooling/heating devices, wherein improved heat conduction between heat exchanger and thermal exchange fluid is accomplished. Additionally, a method is disclosed to minimize the necessary delay used to protect the thermoelectric modules against thermal shock when switching from heat to cold, or vice versa. Thermal shock can damage thermoelectric modules when the direction of current passing through the modules is instantly switched.
