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Low profile intervertebral implant
专利权人:
David Koch;Markus Hunziker;Thomas Kueenzi;Ryan Walsh;Tom Pepe
发明人:
Thomas Kueenzi,Ryan Walsh,Tom Pepe,Markus Hunziker,David Koch
申请号:
US12743098
公开号:
US08540774B2
申请日:
2008.11.05
申请国别(地区):
US
年份:
2013
代理人:
摘要:
The present invention is directed to a low profile intervertebral implant (10) for implantation in an intervertebral disc space (D) in-between adjacent vertebral bodies (V). The intervertebral implant includes a plate (40) preferably coupled to a spacer (20). The plate is preferably formed from a first material and the spacer is preferably formed from a second material, the first material being different from the second material. The plate is preferably sized and configured so that the plate does not extend beyond the perimeter of the spacer. In this manner, the plate preferably does not increase the height profile (hs) of the spacer and the plate may be implanted within the intervertebral disc space in conjunction with the spacer.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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