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Hot melt adhesive
专利权人:
ヘンケルジャパン株式会社
发明人:
井上 健太郎
申请号:
JP2011203071
公开号:
JP5850683B2
申请日:
2011.09.16
申请国别(地区):
JP
年份:
2016
代理人:
摘要:
The present invention provides hot melt adhesives for disposable products. The hot melt adhesives may be applied at high-speed and at low temperature ranges. The hot melt adhesives also provide excellent adhesion to polyethylene and a nonwoven fabric. The hot melt adhesive comprises (A) a thermoplastic block copolymer, which is a copolymer of a vinyl-based aromatic hydrocarbon with a conjugated diene compound; and (B) a propylene homopolymer having a melting point of 100° C. or lower, which is obtainable by polymerizing propylene using a metallocene catalyst. The disposable products are produced at high-speeds and low temperature with the inventive hot melt, and therefore, the disposal products are produced efficiently and safely, and a nonwoven fabric and a polyethylene film of the disposable products are less likely to peel.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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