A dental curing light includes a device body that efficiently conducts heat away from the light emitting diode (LED) portion of the curing light. The device body includes a proximal gripping end and a distal head end. The device body is formed from a thermally conductive body material. Excellent heat conduction away from the LED dies is achieved using a thermally conductive layer disposed over the device body. The thermally conductive layer serves as a conduit to quickly conduct heat away from the LED dies for dissipation within the material of the device body. In this manner, the material of the device body serves as a highly efficient heat dissipater. The surface area coupling the thermally conductive layer to the device body is sufficiently large that a majority (e.g., substantially all) of heat being conducted by the thermally conductive layer is transferred to the device body during operation of the device.
