Gary L. Bowlin,Michael J. McClure,David G. Simpson,Hu Yang
申请号：
US13811286
公开号：
US20130178949A1
申请日:
2011.06.28
申请国别(地区):
US
年份:
2013
代理人:
摘要：
Electrospun materials are fabricated using air-flow impedance technology, which results in the production of scaffolds in which some regions are dense with low porosity and others regions are less dense and more porous. The dense regions provide structural support for the scaffold while the porous regions permit entry of cells and other materials into the scaffold, e.g. when used for tissue engineering.
