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专利权人:
HOYA株式会社
发明人:
古田 剛
申请号:
JP2009134760
公开号:
JP5377085B2
申请日:
2009.06.04
申请国别(地区):
JP
年份:
2013
代理人:
摘要:

PROBLEM TO BE SOLVED: To provide an endoscope which obtains high heat dissipation performance by a simple structure without increasing the diameter of a distal end rigid portion.

SOLUTION: In the endoscope 10 having an imaging unit 50 which is formed by coupling a solid-state image sensing device 51 and a driving circuit board 53 located in the back of the device 51 via an adhesive 57 and is inserted into an inner space of the distal end rigid portion 13 of the endoscope 10, a heat dissipation member 52 which makes surface-contact with the surface on the side of the driving circuit board 53 of the device 51 and shows thermal conductivity higher than that of the adhesive 57 is placed between the device 51 and the driving circuit board 53.

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