Chi-En Lin,David Probst,Mohsen Askarinya,Akhil Srinivasan,Melissa Tsang,Michael E. Miller,Parisa Kamgar
申请号：
US16375752
公开号：
US20200315504A1
申请日:
2019.04.04
申请国别(地区):
US
年份:
2020
代理人:
摘要：
The invention includes method and materials designed to measure the material properties (e.g. thickness) of layers of material in a sensor using non-Faradaic EIS (Electrochemical Impedance Spectroscopy) methods. The methods are non-destructive, very sensitive and rapid. Typically in these methods, an AC voltage is applied to the desired material layer while the output current and therefore impedance is measured. This voltage can be applied in multiple frequencies in sweep mode in order to detect both the material and, for example, the thickness of the target material. In this way, EIS allows the characterization of properties of various layers of material disposed in devices such as electrochemical glucose sensors.
