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JIG FOR MICRONEEDLE ARRAY PLACEMENT AND MICRONEEDLE ARRAY DEVICE
专利权人:
Yuko Wada;Takuya Tamaru;Isamu Nonaka
发明人:
Takuya Tamaru,Isamu Nonaka,Yuko Wada
申请号:
US13880714
公开号:
US20130218084A1
申请日:
2011.10.27
申请国别(地区):
US
年份:
2013
代理人:
摘要:
The invention relates to a jig for microneedle array placement that is provided with a main jig body with through holes through which the microneedles of the microneedle array will pass and a guiding part that guides the microneedle array to be incorporated into the main jig body and leads the microneedles into the through holes, and a microneedle array device using the jig for microneedle array placement. The invention prevents the deformation of the skin surface during puncture and allows penetration of the microneedles to the prescribed depth under the skin.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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