A sensor bed pad has a plurality of layers including an outermost layer made of a flexible material and a pair of inner layers, wherein each inner layer has an electrically conductive material thereon. A central layer is positioned between the pair of inner layers, wherein the inner layers are made of cloth, and wherein the central layer has a plurality of openings extending therethrough. The electrical conductive material of one of the inner layers contacts the electrical conductive material of the other interlayer through the openings in the central layer when a force is applied to the sensor bed pad to complete an electrical circuit between the inner layers.
